Manufacturing method for monolithic ceramic electronic component

ABSTRACT

In a manufacturing method for a monolithic ceramic electronic component, a ceramic paste is applied by using an application plate to a side surface of each of a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block. In the applying step, the ceramic paste is transferred to the side surface by moving the green chips and the application plate relative to each other in the direction in which the side surface extends while separating the green chips from the application plate, in a state where the ceramic paste is connected to both the green chips and the application plate.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a manufacturing method for a monolithicceramic electronic component, and more specifically, to a method forforming a protective area at the side of internal electrodes in amonolithic ceramic electronic component.

2. Description of the Related Art

A monolithic ceramic capacitor exists as an example of a monolithicceramic electronic component to which the present invention is directed.To manufacture a monolithic ceramic capacitor, typically, a step asillustrated in FIGS. 22A and 22B is performed. That is, a first ceramicgreen sheet 3 on which a first internal electrode 1 is formed, and asecond ceramic green sheet 4 on which a second internal electrode 2 isformed are alternately stacked in a plurality of layers. A raw componentbody is obtained by this stacking step. After the raw component body isfired, first and second external electrodes are formed on opposing firstand second end surfaces of the sintered component body. Thus, the firstand second internal electrodes 1 and 2 led out to the first and secondend surfaces are electrically connected to the first and second externalelectrodes, respectively, and a monolithic ceramic capacitor iscompleted.

In recent years, monolithic ceramic capacitors are steadily decreasingin size, while monolithic ceramic capacitors that can provide highcapacitance are being desired. To meet such a demand, it is effective toincrease the effective area occupied by each of the internal electrodes1 and 2 on the stacked ceramic green sheets 3 and 4, that is, theopposing area of the internal electrodes 1 and 2. To increase such aneffective area, it is important to reduce the dimensions of a protectivearea 5 at the side and the dimensions of a protective area 6 at the endillustrated in FIGS. 22A and 22B.

However, reducing the dimensions of the protective area 6 at the endundesirably increases the risk of short-circuiting of the first externalelectrode and the second external electrode via either one of theinternal electrodes 1 and 2. Accordingly, it is appreciated thatconsidering the reliability of the monolithic ceramic capacitor, it ismore preferable to reduce the dimensions of the protective area 5 at theside than to reduce the dimensions of the protective area 6 at the end.

An example of an effective method for reducing the dimensions of theprotective area 5 at the side is described in Japanese Unexamined PatentApplication Publication No. 3-108306. According to the method describedin Japanese Unexamined Patent Application Publication No. 3-108306, alaminate is prepared which has a laminated structure including aplurality of ceramic layers and a plurality of internal electrodes thatare in a raw state, with the internal electrodes being exposed on itsside surface, and this laminate is dipped in a ceramic slurry to therebyform the protective area at the side.

However, the technique described in Japanese Unexamined PatentApplication Publication No. 3-108306 mentioned above has the followingproblems.

That is, when dipping the laminate in the ceramic slurry, the ceramicslurry is also applied onto a surface of the laminate other than thesurface that is to become the protective area at the side, for example,the principal surface. Moreover, in the case of applying the ceramicslurry by dipping, the control for making the thickness of the appliedceramic slurry uniform is not easy. For example, as illustrated in FIG.23, when a ceramic slurry 8 is applied to a laminate 7, owing to thesurface tension acting on the ceramic slurry 8, at corners 9 of thelaminate 7, the applied thickness of the ceramic slurry 8 tends tobecome thin, making it difficult to secure a desired applied thickness.For these reasons, water tends to enter from the corners 9, leading to adecrease in reliability in some cases. Moreover, the monolithic ceramiccapacitor obtained is prone to dimensional variations.

Similar problems can be encountered not only when manufacturingmonolithic ceramic capacitors but also when manufacturing monolithicceramic electronic components other than monolithic ceramic capacitors.

SUMMARY OF THE INVENTION

Accordingly, preferred embodiments of the present invention provide amanufacturing method for a monolithic ceramic electronic component thatcan address the above-mentioned problems.

According to a preferred embodiment of the present invention, amanufacturing method for a monolithic ceramic electronic component firstincludes the steps of preparing a mother block, the mother blockincluding a plurality of ceramic green sheets that are stacked on eachother, and an internal electrode pattern arranged along each of aplurality of interfaces between the ceramic green sheets, and cuttingthe mother block along a first cutting line and a second cutting lineextending in mutually perpendicular or substantially perpendiculardirections to obtain a plurality of green chips, the green chips eachhaving a laminated structure including a plurality of ceramic layers anda plurality of internal electrodes that are in a raw state, the internalelectrodes being exposed on a cut side surface that is produced bycutting along the first cutting line.

Next, after performing the step of applying a ceramic paste to the cutside surface to form a raw ceramic protective layer and obtain a rawcomponent body, the step of firing the raw component body is performed.

In the manufacturing method mentioned above, the applying step includesthe steps of preparing an application plate that holds the ceramicpaste, bringing the ceramic paste held by the application plate intocontact with the cut side surface of each of the green chips, andtransferring the ceramic paste to the cut side surface of each of thegreen chips, by moving each of the green chips and the application platerelative to each other in a direction in which the cut side surfaceextends while separating each of the green chips from the applicationplate in a state in which the ceramic paste is connected to both of eachof the green chips and the application plate.

According to a preferred embodiment of the present invention, the greenchips cut in the cutting step are arrayed in row and column directions,the applying step further includes the step of tumbling the green chipsin a state in which the green chips arrayed in the row and columndirections are spaced apart from each other, to make the cut sidesurface of each of the green chips uniformly an open surface, and in theapplying step, the ceramic paste is simultaneously applied to the cutside surface of each of the green chips that has become the open surfaceas a result of the tumbling step.

According to a preferred embodiment of the present invention, amanufacturing method for a monolithic ceramic electronic componentincludes the steps of preparing a mother block, the mother blockincluding a plurality of ceramic green sheets that are stacked, and aninternal electrode pattern arranged along each of a plurality ofinterfaces between the ceramic green sheets, performing first cutting,the first cutting including cutting the mother block along a firstcutting line to obtain a plurality of rod-shaped green block bodies, therod-shaped green block bodies each having a laminated structureincluding a plurality of ceramic layers and a plurality of internalelectrodes that are in a raw state, the internal electrodes beingexposed on a cut side surface that is produced by cutting along thefirst cutting line, applying a ceramic paste to the cut side surface toform a raw ceramic protective layer, performing second cutting, thesecond cutting including cutting each of the rod-shaped green blockbodies on which the raw ceramic protective layer has been formed, alonga second cutting line extending in a direction perpendicular orsubstantially perpendicular to the first cutting line to obtain aplurality of raw component bodies, and firing each of the raw componentbodies.

In the manufacturing method mentioned above, the applying step includesthe steps of preparing an application plate that holds the ceramicpaste, bringing the ceramic paste held by the application plate intocontact with the cut side surface of each of the rod-shaped green blockbodies, and transferring the ceramic paste to the cut side surface ofeach of the rod-shaped green block bodies, by moving each of therod-shaped green block bodies and the application plate relative to eachother in a direction in which the cut side surface extends whileseparating each of the rod-shaped green block bodies from theapplication plate in a state in which the ceramic paste is connected toboth of each of the rod-shaped green block bodies and the applicationplate.

According to a preferred embodiment of the present invention, therod-shaped green block bodies cut in the first cutting step are arrayedin a predetermined direction, the applying step further includes thestep of tumbling the rod-shaped green block bodies in a state in whichthe rod-shaped green block bodies arrayed in the predetermined directionare spaced apart from each other, to make the cut side surface of eachof the rod-shaped green block bodies uniformly an open surface, and inthe applying step, the ceramic paste is simultaneously applied to thecut side surface of each of the rod-shaped green block bodies that hasbecome the open surface as a result of the tumbling step.

According to a preferred embodiment of the present invention, theapplication plate includes an application surface that abuts against thecut side surface of each of the green chips or the rod-shaped greenblock bodies and is provided with a recess to hold the ceramic paste,the recess being filled with the ceramic paste.

According to a preferred embodiment of the present invention, theceramic paste has a viscosity of about 100 to 10000 mPa at about 10 rpmas measured with an E-type viscometer, for example.

According to a preferred embodiment of the present invention, the stepof preparing the mother block includes the steps of preparing theceramic green sheets, forming the internal electrode pattern on each ofthe ceramic green sheets, and stacking the ceramic green sheets whileshifting the ceramic green sheets from each other by a predetermineddistance in a predetermined direction.

According to a preferred embodiment of the present invention, themanufacturing method for a monolithic ceramic electronic component mayfurther include the step of forming an external electrode on apredetermined surface of the component body so as to be electricallyconnected to a specific one of the internal electrodes.

According to a preferred embodiment of the present invention mentionedabove, the ceramic paste is applied by using the application plate tothe cut side surface of the green chip or the rod-shaped green blockbody. Therefore, dimensional variations caused by adhesion of theceramic paste to other surfaces can be suppressed and prevented.

Also, the ceramic paste is transferred to the cut side surface by movingthe green chip or the rod-shaped green block body and the applicationplate relative to each other in a direction in which the cut sidesurface extends while separating the green chip or the rod-shaped greenblock body from the application plate in a state in which the ceramicpaste is connected to both the green chip or the rod-shaped green blockbody and the application plate. Therefore, the thickness of the ceramicpaste applied on the cut side surface of the green chip or therod-shaped green block body can be made more uniform.

The above-mentioned applying step is performed preferably by using theapplication plate including an application surface that abuts againstthe side of the green chip or the rod-shaped green block body on whichthe internal electrodes are exposed, and is provided with a recess tohold the ceramic paste, the recess being filled with the ceramic paste.Accordingly, the ceramic paste can be applied to only the cut sidesurface of the green chip or the rod-shaped green block body morereliably.

A ceramic paste having a viscosity of about 100 mPa to about 10000 mPaat about 10 rpm as measured with an E-type viscometer is used, forexample. Accordingly, good shape retention can be obtained for the rawceramic protective layer formed by application of the ceramic paste.Also, use of the application plate makes it possible to smoothlytransfer the ceramic paste from the application plate to the green chipor the rod-shaped green block body.

According to the preferred embodiments of the present inventiondescribed above, when the above-mentioned application of the ceramicpaste is performed at one time for each of a plurality of green chipsarrayed in the row and column directions and whose cut side surface isso oriented as to become an open surface, as in the case of performingthe applying step for the rod-shaped green block body, the applying stepcan be implemented efficiently, and variations in the applied thicknessof the ceramic paste among the green chips can be suppressed andprevented.

According to the preferred embodiments of the present inventiondescribed above, in a state in which a plurality of rod-shaped greenblock bodies obtained by performing the first cutting step mentionedabove are arrayed in a predetermined direction, when performing theapplying step, the tumbling step is performed which includes tumblingthe rod-shaped green block bodies in a state in which the rod-shapedgreen block bodies arrayed in the predetermined direction are spacedapart from each other, thereby making the cut side surface of each ofthe rod-shaped green block bodies uniformly an open surface, and in theapplying step, the ceramic paste is simultaneously applied to the cutside surface of each of the rod-shaped green block bodies that hasbecome the open surface as a result of the tumbling step. Accordingly,the applying step can be implemented even more efficiently, andvariations in the applied thickness of the ceramic paste among the rawcomponent bodies obtained in the second cutting step can be furthersuppressed and prevented.

The above and other elements, features, steps, characteristics andadvantages of the present invention will become more apparent from thefollowing detailed description of the preferred embodiments withreference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of the outward appearance of a monolithicceramic capacitor as an example of a monolithic ceramic electroniccomponent obtained by a manufacturing method according to a firstpreferred embodiment of the present invention.

FIG. 2 is a perspective view of the outward appearance of a componentbody included in the monolithic ceramic capacitor illustrated in FIG. 1.

FIG. 3 is a perspective view of the outward appearance of a green chipprepared to obtain the component body illustrated in FIG. 2.

FIG. 4 is a plan view of each of ceramic green sheets which are preparedto obtain the green chip illustrated in FIG. 3 and on which an internalelectrode pattern is formed.

FIGS. 5A and 5B are plan views illustrating a step of stacking theceramic green sheets illustrated in FIG. 4 while shifting the ceramicgreen sheets from each other by a predetermined distance.

FIGS. 6A and 6B are respectively a plan view of a plurality of greenchips obtained by cutting a mother block that is obtained by thestacking step illustrated in FIGS. 5A and 5B, and a plan viewillustrating a state in which the green chips arrayed in the row andcolumn directions in FIG. 6A have become spaced apart from each other.

FIGS. 7A and 7B are views as seen from the direction of the end surfaceof the green chips, illustrating a tumbling step of tumbling the greenchips illustrated in FIG. 6B.

FIG. 8 is a view as seen from the direction of the principal surface ofthe green chips, illustrating an applying step of applying a ceramicpaste to form a raw first ceramic protective layer on a first cut sidesurface of the green chips that has become an open surface as a resultof the tumbling step illustrated in FIGS. 7A and 7B.

FIG. 9 is a plan view of an application plate illustrated in FIG. 8.

FIG. 10 is a view as seen from the direction of the cut side surface ofeach green chip, illustrating a step of moving the green chip and theapplication plate relative to each other in the direction in which thecut side surface extends, which is performed is the applying stepillustrated in FIG. 8.

FIG. 11 is a view as seen from the direction of the end surface of thegreen chips, illustrating a state in which the raw first ceramicprotective layer has been formed on the first cut side surface of thegreen chips as a result of the applying step illustrated in FIG. 8.

FIGS. 12A and 12B are views as seen from the direction of the endsurface of the green chips, illustrating a tumbling step of tumbling thegreen chips illustrated in FIG. 11 again.

FIG. 13 is a view as seen from the direction of the principal surface ofthe green chips, illustrating an applying step of applying the ceramicpaste to form a raw second ceramic protective layer on a second cut sidesurface of the green chips that has become an open surface as a resultof the tumbling step illustrated in FIGS. 12A and 12B.

FIG. 14 is a view as seen from the direction of the end surface of thegreen chips, illustrating raw component bodies obtained as the rawsecond ceramic protective layer is formed on the second cut side surfaceof the green chips as a result of the applying step illustrated in FIG.13.

FIG. 15 is a view as seen from the direction of the end surface of theraw component bodies, illustrating a step of collecting each rawcomponent body from an adhesive sheet illustrated in FIG. 14.

FIG. 16 is a plan view of an application plate according to a firstmodification, illustrating a second preferred embodiment of the presentinvention.

FIG. 17 is a plan view of an application plate according to a secondmodification, illustrating a third preferred embodiment of the presentinvention.

FIG. 18 is a plan view of an application plate according to a thirdmodification, illustrating a fourth preferred embodiment of the presentinvention.

FIG. 19 is a plan view of an application plate according to a fourthmodification, illustrating a fifth preferred embodiment of the presentinvention.

FIG. 20 is a perspective view of the outward appearance of a green chip,illustrating a sixth preferred embodiment of the present invention.

FIGS. 21A and 21B are plan views of ceramic green sheets which areprepared to obtain the green chip illustrated in FIG. 20 and on which aninternal electrode pattern is formed.

FIGS. 22A and 22B are respectively a plan view of a first ceramic greensheet on which a first internal electrode is formed, and a plan view ofa second ceramic green sheet on which a second internal electrode isformed, illustrating a typical manufacturing method for a monolithicceramic capacitor according to the related art.

FIG. 23 is a cross-sectional view of a laminate for explaining problemsthat can be encountered in a manufacturing method for a monolithicceramic capacitor according to the related art, illustrating aphenomenon that can occur when a ceramic slurry is applied to thelaminate.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, preferred embodiments of the present invention aredescribed, with a monolithic ceramic capacitor taken as a non-limitingexample of monolithic ceramic electronic component.

FIGS. 1 to 15 illustrate a first preferred embodiment of the presentinvention.

First, as illustrated in FIG. 1, a monolithic ceramic capacitor 11includes a component body 12. The component body 12 is illustratedsingly in FIG. 2. The component body 12 preferably has a rectangularparallelepiped or substantially rectangular parallelepiped shapeincluding a pair of opposing principal surfaces 13 and 14, a pair ofopposing side surfaces 15 and 16, and a pair of opposing first andsecond end surfaces 17 and 18.

In describing the component body 12 in detail, reference is also made toFIG. 3 illustrating the outward appearance of a green chip 19 preparedto obtain the component body 12. As will be appreciated from adescription given later, the component body 12 corresponds to acomponent body obtained by forming a pair of first and second ceramicprotective layers 22 and 23 in their raw state on a pair of opposingfirst and second side surfaces (hereinafter, referred to as “cut sidesurfaces”) 20 and 21 of the green chip 19 illustrated in FIG. 3 and thenfiring the resulting green chip 19. In the following description, theportion of the fired component body 12 which is derived from the greenchip 19 is referred to as a laminate section 24.

The laminate section 24 in the component body 12 has a laminatedstructure including a plurality of ceramic layers 25 extending along thedirection of the principal surfaces 13 and 14 and stacked in a directionperpendicular or substantially perpendicular to the principal surfaces13 and 14, and a plurality of pairs of first and second internalelectrodes 26 and 27 each formed along the interface between the ceramiclayers 25. Also, the component body 12 includes the pair of ceramicprotective layers 22 and 23 that are placed on the cut side surfaces 20and 21 of the laminate section 24 so as to provide the component body 12with its side surfaces 15 and 16, respectively. The ceramic protectivelayers 22 and 23 preferably have the same thickness.

While in FIG. 1, the boundary between the laminate section 24 and eachof the ceramic protective layers 22 and 23 is depicted clearly, theboundary is depicted clearly for the convenience of description. Inactuality, such a boundary does not appear so clearly.

The first and second internal electrodes 26 and 27 oppose each other viaeach of the ceramic layers 25. This opposing arrangement causeselectrical characteristics to manifest themselves. That is, acapacitance is generated in the case of the monolithic ceramic capacitor11.

The first internal electrodes 26 include an exposed end that is exposedon the first end surface 17 of the component body 12, and the secondinternal electrodes 27 have an exposed end that is exposed on the secondend surface 18 of the component body 12. However, the internalelectrodes 26 and 27 are not exposed on the side surfaces 15 and 16 ofthe component body 12 because the ceramic protective layers 22 and 23described above are placed on these end surfaces.

The monolithic ceramic capacitor 11 further includes external electrodes28 and 29. The external electrodes 28 and 29 are arranged on at leastthe pair of end surfaces 17 and 18 of the component body 12 so as to beelectrically connected to the exposed ends of the internal electrodes 26and 27, respectively.

As the conductive material for the internal electrodes 26 and 27, forexample, Ni, Cu, Ag, Pd, Ag—Pd alloy, Au, or other suitable material maypreferably be used.

As the ceramic material forming the ceramic layers 25 and the ceramicprotective layers 22 and 23, for example, a dielectric ceramiccontaining BaTiO₃, CaTiO₃, SrTiO₃, CaZrO₃, or other suitable material asits principal component may preferably be used.

Preferably, at least the principal component of the ceramic materialforming the ceramic protective layers 22 and 23 is the same as that ofthe ceramic material forming the ceramic layers 25. In this case, mostpreferably, a ceramic material of the same composition is used for boththe ceramic layers 25 and the ceramic protective layers 22 and 23.

The present invention is also applicable to a monolithic ceramicelectronic component other than a monolithic ceramic capacitor. In acase where the monolithic ceramic electronic component is apiezoelectric component, a piezoelectric ceramic such as a PZT ceramicis preferably used, and in a case where the monolithic ceramicelectronic component is a thermistor, a semiconductor ceramic such as aspinel ceramic is preferably used, for example.

As described above, the external electrodes 28 and 29 are provided on atleast the pair of end surfaces 17 and 18 of the component body 12. Inthis preferred embodiment, the external electrodes 28 and 29 include aportion that goes around and extends over a portion of each of theprincipal surfaces 13 and 14 and the side surfaces 15 and 16.

Although not illustrated, the external electrodes 28 and 29 preferablyinclude a primary coating and a plating layer formed on the primarycoating. As the conductive material for the primary coating, forexample, Cu, Ni, Ag, Pd, Ag—Pd alloy, Au, or other suitable material maypreferably be used. The primary coating may be formed either by using aco-firing method that applies a conductive paste onto the component body12 that has not been fired yet and firing the conductive pastesimultaneously with the component body 12, or by using a post-firingmethod that applies and fires a conductive paste onto the component body12 that has already been fired. Alternatively, the primary coating maybe formed directly by plating, or may be formed by curing conductiveresin including thermosetting resin.

The plating layer formed on the primary coating is preferably of atwo-layer structure including Ni-plating and Sn-plating on top of theNi-plating, for example.

Next, referring further to FIGS. 4 to 15, a manufacturing method for themonolithic ceramic capacitor 11 described above is described.

First, as partially illustrated in FIG. 4, each of ceramic green sheets31 that are to become the ceramic layers 25 are prepared. Morespecifically, the ceramic green sheets 31 are shaped by using a diecoater, a gravure coater, a micro gravure coater, or other suitabledevice on a carrier film (not illustrated). The thickness of the ceramicgreen sheets 31 is preferably not more than about 3 μm, for example.

Next, similarly as illustrated in FIG. 4, a conductive paste is printedwith a predetermined pattern on the ceramic green sheets 31. As aresult, the ceramic green sheets 31 each provided with an internalelectrode pattern 32 that is to become each of the internal electrodes26 and 27 are obtained. More specifically, a plurality of rows ofstrip-shaped internal electrode patterns 32 are formed on the ceramicgreen sheets 31. The thickness of the internal electrode pattern 32 ispreferably not more than about 1.5 μm, for example.

In FIGS. 5A and 5B, first cutting lines 33 along a first direction thatis the longitudinal direction (the horizontal direction in FIGS. 5A and5B) in which the strip-shaped internal electrode pattern 32 extends, andsecond cutting lines 34 along a second direction that is the widthdirection (the vertical direction in FIGS. 5A and 5B) perpendicular orsubstantially perpendicular to the cutting lines 33 are partiallyillustrated. The strip-shaped internal electrode pattern 32 has such ashape that two internal electrodes 26 and 27 coupled to each otherthrough their lead sections are arranged contiguously along thelongitudinal direction. FIGS. 5A and 5B are enlarged from FIG. 4.

Next, as illustrated in FIGS. 5A and 5B, a predetermined number of theceramic green sheets 31 with the internal electrode pattern 32 formed asdescribed above are stacked with a shift of a predetermined distance,that is, half the widthwise dimension of the internal electrode pattern32, along the width direction, and a predetermined number of ceramicgreen sheets on which no conductive paste is printed and which serve asthe outer layers are stacked on top and bottom of the resulting stack.Because the cutting lines 33 and 34 are illustrated in both FIGS. 5A and5B, how to shift the ceramic green sheets 31 when stacking can be easilyunderstood by comparison between FIGS. 5A and 5B.

As a result of the stacking step described above, a mother block 35illustrated in FIG. 6A is obtained. In FIGS. 6A and 6B, the uppermostinternal electrode pattern 32 or internal electrode 26 located insidethe mother block 35 is indicated by broken lines.

Next, the mother block 35 is pressed in the stacking direction by amethod such as isostatic pressing.

Next, the mother block 35 is cut along the first cutting lines 34 andthe second cutting lines 33 that are perpendicular or substantiallyperpendicular to each other. As a result, as illustrated in FIG. 6A, aplurality of green chips 19 being arrayed in the row and columndirections are obtained. Dicing, force-cutting, laser cutting, or othersuitable process is preferably used for this cutting. In drawings suchas FIG. 6A, for reasons related to the creation of the drawings, asingle mother block 35 is depicted as being so dimensioned that sixgreen chips 19 are extracted from the mother block 35. However, inactuality, the mother block 35 is so dimensioned that more green chips19 are extracted.

As illustrated singly in FIG. 3, each of the green chips 19 has alaminated structure including the plurality of ceramic layers 25 and theplurality of internal electrodes 26 and 27 which are in their raw state.The cut side surfaces 20 and 21 of the green chips 19 are surfaces thatare produced by cutting along the first cutting lines 34, and the endsurfaces 36 and 37 are surfaces that are produced by cutting along thesecond cutting lines 33. All of the internal electrodes 26 and 27 areexposed on the cut side surfaces 20 and 21. Only the first internalelectrodes 26 are exposed on the end surface 36, and only the secondinternal electrodes 27 are exposed on the other end surface 37.

As illustrated in FIG. 6A, the green chips 19 arrayed in the row andcolumn directions are affixed onto an adhesive sheet 38 havingexpandability. Then, the adhesive sheet 38 is expanded as indicated byan arrow 39 by an expander (not illustrated). As a result, asillustrated in FIG. 6B, the green chips 19 arrayed in the row and columndirections become spaced apart from each other.

At this time, the adhesive sheet 38 is expanded to an extent that allowsthe green chips 19 to be smoothly tumbled without hitting each other inthe tumbling step that will be performed later. Although depending onthe dimensions of the green chips 19, as an example, the adhesive sheet38 is expanded to about 160% of the original dimensions.

As the adhesive sheet 38 mentioned above, for example, an adhesive sheetmade of polyvinyl chloride resin whose adhesive layer is given by anacrylic adhesive is used. The adhesive sheet 38 has such a plasticitythat the adhesive sheet 38 does not completely return to the originalshape once expanded. Therefore, handling of the adhesive sheet 38 thathas been expanded is easy. For example, after the green chips 19 areobtained by cutting the mother block 35, there is a possibility that thecut side surfaces 20 and 21 or end surfaces 36 and 37 of the adjacentgreen chips 19 adhere to each other again owing to the binder includedin the green chips 19. However, since the adhesive sheet 38 does notcompletely return to the original shape once expanded, it is possible toavoid a situation where the cut side surfaces 20 and 21 or the endsurfaces 36 and 37 come into contact with and therefore adhere to eachother again.

Next, a tumbling step is performed. In the tumbling step, the greenchips 19 are tumbled to thereby make the first cut side surface 20 ofeach of the green chips 19 uniformly an open surface.

Accordingly, as illustrated in FIG. 7A, the green chips 19 are placed ona support base 40 together with the adhesive sheet 38. On the otherhand, a tumbling action plate 41 is placed so as to be able to act onthe green chips 19 from above. The support base 40 and the tumblingaction plate 41 are preferably made of silicone rubber.

Next, the support base 40 is moved in the direction of an arrow 42 withrespect to the tumbling action plate 41. As a result, as illustrated inFIG. 7B, the green chips 19 are rotated by 90 degrees all at once,resulting in a state in which their first cut side surface 20 facesupwards. When the tumbling action plate 41 is removed in this state, thefirst cut side surface 20 becomes an open surface.

To perform the above-mentioned tumbling of the green chips 19 moresmoothly, the tumbling operation may be performed after transferring thegreen chips 19 from the adhesive sheet 38 onto an adhesive rubber sheet.In this case, it is preferable that the adhesive rubber sheet have anelastic coefficient of not more than about 50 MPa and a thickness of notmore than about 5 mm, for example.

Next, an applying step is performed as required as illustrated in FIG.8. In the applying step, a ceramic paste 43 is applied to the first cutside surface 20 of the green chips 19 that has become an open surface tothereby form the first ceramic protective layer 22 (see FIG. 2) in itsraw state.

For that purpose, an application plate 44 illustrated in FIGS. 8 and 9is prepared. The application plate 44 has an application surface 45 thatabuts against the cut side surface 20 of the green chips 19. Theapplication surface is provided with a recess 46 to hold the ceramicpaste 43. The recess 46 is filled with the ceramic paste 43. In thispreferred embodiment, as clearly illustrated in FIG. 9, the recess 46 isgiven by a plurality of grooves.

In performing the applying step, as illustrated in FIG. 8, the followingsteps are performed: abutting the application surface 45 of theapplication plate 44 against the cut side surface 20 of the green chips19, and bringing the ceramic paste 43 filled in the recess 46 intocontact with the cut side surface 20; and transferring the ceramic paste43 filled in the recess 46 to the cut side surface 20 of the green chips19 while separating the green chips 19 from the application plate 44. Inthis case, capillary action or the like also works so that the ceramicpaste 43 is applied to the entire cut side surface 20 of the green chips19. On the other hand, the ceramic paste 43 is not applied to surfacesof the green chips 19 other than the cut side surface 20. The thicknessof the ceramic paste 43 applied can be adjusted by adjusting the width,depth, or arrangement pitch of the recess 46, the viscosity of theceramic paste 43 or the solids content in the ceramic paste 43, and soon. Also, the green chip 19 side may be placed at the bottom and theceramic paste 43 side may be placed at the top so as to facilitatetransfer of the ceramic paste 43 toward the green chips 19 by gravity.

If the application plate 44 is simply brought closer to or separatedaway from the green chips 19, the ceramic paste 43 becomes stringy whenseparating the application plate 44, resulting in problems such as theceramic paste 43 being thick at the center and thin at the four corners,and contact marks being left in the portion where the cut side surface20 and the application surface 45 makes contact. In some cases, it isnot possible to apply the ceramic paste 43 at uniform thickness becauseof such problems.

To reduce such problems, the following step is performed. That is, whenseparating the green chips 19 from the application plate 44, the greenchips 19 and the application plate 44 are moved relative to each otherin the direction in which the cutting side surface 20 extends, in astate where the ceramic paste 43 is connected to both the green chips 19and the application plate 44.

As illustrated in FIG. 10, the possible forms of the above-mentionedrelative movement include a reciprocating motion 47 along the long sideof the cutting side surface 20, a reciprocating motion 48 along theshort side, a reciprocating motion 49 or 50 along the diagonal, acircular or elliptical motion 51, a composite motion of these motions,or a motion along a random direction. In particular, by combining thereciprocating motion 49 along the diagonal with the reciprocating motion50 along the diagonal, it is easy to apply a sufficient amount ofceramic paste so as to extend over the four corners of the cut sidesurface 20 where the applied thickness of the ceramic paste tends tobecome thin. Therefore, it is easy to secure a predetermined thicknessor more of ceramic paste at the four corners, and an improvement in themoisture resistance of the obtained monolithic ceramic capacitor 11 canbe anticipated.

To apply the ceramic paste 43 with uniform thickness, the applying stepmay be executed in a plurality of times. For example, after the ceramicpaste 43 is dried once in a state where the contact marks of theapplication plate 44 remain, the cut side surface 20 side of the greenchips 19 is further dipped in a ceramic paste film that is formed in aflat shape at uniform thickness. As a result, the contact marks of theapplication plate 44 disappear, making it possible to apply the ceramicpaste at uniform thickness.

Desirably, the viscosity of the ceramic paste 43 is sufficiently low toallow the ceramic paste 43 to be smoothly transferred from within therecess 46 to the green chips 19, and is sufficiently high to allowsurface tension to present the shape of the raw ceramic protective layer22 formed by the ceramic paste 43 from being fluidized. The preferredvalue of viscosity at about 10 rpm as measured with an E-type viscometeris about 100 mPa to about 10000 mPa. The viscosity of the ceramic paste43 can be adjusted by adjusting the ratio between the solvent and thebinder contained in the ceramic paste 43, the kind of the binder, or thelike.

FIG. 11 illustrates a state in which, while the green chips 19 aresupported by the support base 40 via the adhesive sheet 38, the firstceramic protective layer 22 in its raw state is formed on the first cutside surface 20 of the green chips 19 as a result of the above-mentionedapplying step.

After the applying step, a drying step is performed as required. In thedrying step, for example, the green chips 19 on which the first ceramicprotective layer 22 has been formed are put in an oven that is set atabout 120° C. for about five minutes, for example. If a hot-air oven isused at this time, drying begins at the surface of the ceramic paste 43that defines the ceramic protective layer 22, and proceeds from theperipheral portion where the thickness is relatively small.Consequently, the applied thickness of the ceramic paste 43 tends tobecome non-uniform. To reduce such an inconvenience, it is preferable touse an oven whose heat source is a far-infrared heater or anear-infrared heater. Use of a far-infrared heater or a near-infraredheater can prevent non-uniformity of the applied thickness because theceramic paste 43 is heated substantially uniformly all the way on theinside.

Next, a tumbling step similar to the step described above with referenceto FIGS. 7A and 7B is performed. That is, the green chips 19 are tumbledto thereby uniformly make the second cut side surface 21 of each of thegreen chips 19 an open surface.

Accordingly, as illustrated in FIG. 12A, the tumbling action plate 41 isplaced so as to be able to act on the green chips 19 supported by thesupport base 40 via the adhesive sheet 38 from above.

Next, the support base 40 is moved in the direction of an arrow 52 withrespect to the tumbling action plate 41. As a result, rotating the greenchips 19 all at once by 90 degrees is repeated twice, resulting in astate as illustrated in FIG. 12B in which the second cut side surface 21of each of the green chips 19 faces upwards. When the tumbling actionplate 41 is removed in this state, the second cut side surface 21becomes an open surface.

Next, an applying step is performed as illustrated in FIG. 13. In theapplying step, the ceramic paste 43 is applied to the second cut sidesurface 21 of the green chips 19 that has become an open surface,thereby forming the second ceramic protective layer 23 (see FIG. 2) inits raw state. In this step, in a manner similar to the step describedabove with reference to FIG. 8, the application plate 44 is prepared,the application surface 45 of the application plate 44 is abuttedagainst the cut side surface 21 of the green chips 19, and the ceramicpaste 43 filled in the recess 46 is brought into contact with the cutside surface 21. Then, the ceramic paste 43 filled in the recess 46 istransferred to the cut side surface 21 of the green chips 19 whileseparating the green chips 19 from the application plate 44.

The following step is performed also in the above-mentioned applyingstep performed for the second time. That is, when separating the greenchips 19 from the application plate 44, the green chips 19 and theapplication plate 44 are moved relative to each other in the directionin which the cutting side surface 20 extends, in a state where theceramic paste 43 is connected to both the green chips 19 and theapplication plate 44.

FIG. 14 illustrates a plurality of raw component bodies 12 in a state inwhich, with the green chips 19 being supported by the support base 40via the adhesive sheet 38, the first and second ceramic protectivelayers 22 and 23 in their raw state are formed on the first and secondcut side surfaces 20 and 21 of the green chips 19, respectively, as aresult of the two applying steps described above.

A drying step is performed as required also after the applying stepperformed for the second time.

Next, after the raw component bodies 12 are detached from the supportbase 40 together with the adhesive sheet 38, as illustrated in FIG. 15,each of the raw component bodies 12 is collected by peeling the adhesivesheet 38 from the raw component body 12. In this step, a knife edge 53is pressed against the adhesive sheet 38 from above while making the rawcomponent body 12 hang down from the adhesive sheet 38, thereby bendingthe adhesive sheet 38 so as to protrude downwards. As the adhesive sheet38 is bent, the raw component body 12 comes off the adhesive sheet 38,drops downwards, and is collected.

Next, the raw component body 12 is fired. Although also depending on theceramic material included in the ceramic green sheets 31 and the ceramicpaste 43 or the metallic material included in the internal electrodes 26and 27, the firing temperature is selected preferably to be within therange of about 900° C. to about 1300° C., for example.

Next, by applying and firing a conductive paste onto the both endsurfaces 17 and 18 of the component body 12 that has been fired, andfurther applying plating as required, the external electrodes 28 and 29are formed. It is also possible to apply a conductive paste to thecomponent body 12 in its raw state, and perform firing of the conductivepaste simultaneously with firing of the raw component body 12.

In this way, the monolithic ceramic capacitor 11 illustrated in FIG. 1is completed.

While the present invention has been described above in association witha specific preferred embodiment, other various modifications arepossible within the scope of the present invention.

For example, the following modifications are also possible for theapplication plate 44 illustrated in FIGS. 8, 9, and 13. FIGS. 16, 17,18, and 19 illustrate first, second, third, and fourth modifications ofthe application plate, respectively. In FIGS. 16 to 19, elementscorresponding to the elements illustrated in FIGS. 8, 9, and 13 aredenoted by the same symbols, and a repetitive description is omitted.

An application plate 44 a illustrated in FIG. 16 includes an applicationsurface 45 that abuts against the side surface of the green chips. Theapplication surface 45 is provided with a plurality of recesses 46having, for example, a circular plane shape. The plurality of recesses46 are distributed at substantially equal intervals across theapplication surface 45. The recesses 46 are filled with the ceramicpaste 43.

An application plate 44 b illustrated in FIG. 17 includes an applicationsurface 45 that abuts against the side surface of the green chips. Theapplication surface 45 is defined by the top surface of a plurality ofprotrusions having, for example, a circular plane shape. The protrusionsare distributed in the plane direction of the application plate 44 b.The portion other than the protrusions serves as a recess 46. The recess46 is filled with the ceramic paste 43.

As in the case of the application plate 44 a illustrated in FIG. 16, anapplication plate 44 c illustrated in FIG. 18 includes an applicationsurface 45 that abuts against the side surface of the green chips, andthe application surface 45 is provided with a plurality of recesses 46.The plurality of recesses 46 are distributed at substantially equalintervals across the application surface 45. One of the unique featuresof the application plate 44 c resides in that the recesses 46 aredefined by through-holes, and the application plate 44 c is arranged toclose the top opening of a paste vessel 54 containing the ceramic paste43.

According to the application plate 44 c illustrated in FIG. 18, ascompared with the application plates 44, 44 a, and 44 b described above,owing to the absence of the bottom of the recesses 46, the contact areabetween the ceramic paste 43 and the application plate 44 c inside therecesses 46 can be made smaller. Thus, it is easier to transfer theceramic paste 43 to the green chip 19 side.

An application plate 44 d illustrated in FIG. 19 preferably has a shapeof a simple flat plate. A relatively thin layer made of the ceramicpaste 43 is provided on top of the upper principal surface of theapplication plate 44 d. By bringing the green chips 19 indicated byimaginary lines into contact with the layer made of the ceramic paste43, the ceramic paste 43 can be applied to, for example, the first cutside surface 20 of the green chips 19.

The internal electrodes and the internal electrode pattern can be alsomodified as follows, for example. FIG. 20 is a perspective viewcorresponding to FIG. 3, illustrating the outward appearance of a greenchip 19 a. FIGS. 21A and 21B are plan views corresponding to FIGS. 5Aand 5B, illustrating ceramic green sheets 31 a on which an internalelectrode pattern 32 a is formed. The ceramic green sheets 31 a areprepared to obtain the green chip 19 a illustrated in FIG. 20.

As illustrated in FIG. 20, the green chip 19 a has a laminated structureincluding a plurality of ceramic layers 25 a and a plurality of firstand second internal electrodes 26 a and 27 a which are in a raw state.The first and second internal electrode 26 a and 27 a are placedalternately in the stacking direction.

On the other hand, as illustrated in FIGS. 21A and 21B, the internalelectrode pattern 32 a formed on the ceramic green sheets 31 apreferably has a meshed configuration, and also preferably has such aform that the portion to become an opposing section as the major portionof the internal electrodes 26 a, and the portion to become an opposingsection as the major portion of the internal electrodes 27 a arearranged contiguously while being alternately connected in the verticaldirection.

FIGS. 21A and 21B illustrate first cutting lines 34 a along a firstdirection, that is, the horizontal direction, and second cutting lines33 a along a second direction perpendicular or substantiallyperpendicular to the first direction, that is, the vertical direction.In the green chip 19 a mentioned above, cut side surfaces 20 a and 21 apreferably are surfaces that are produced by cutting along the firstcutting lines 34 a, and end surfaces 36 a and 37 a are surfaces that areproduced by cutting along the second cutting lines 33 a. All of theinternal electrodes 26 a and 27 a are exposed on the cut side surfaces20 a and 21 a. Only the first internal electrodes 26 a are exposed onthe end surface 36 a, and only the second internal electrodes 27 a areexposed on the other end surface 37 a.

In the meshed internal electrode pattern 32 a illustrated in FIGS. 21Aand 21B, perforations 65 where no internal electrode pattern is to beformed are arranged in a staggered manner. The perforations 65preferably have an octagonal shape that is elongated in the verticaldirection. The portion to become the lead section for each of theinternal electrodes 26 a and 27 a is located between the perforations 65that are adjacent to each other in the vertical direction.

In stacking the ceramic green sheets 31 a, as illustrated in FIGS. 21Aand 21B, the ceramic green sheets 31 a are stacked with a shift so thattheir internal electrode patterns 32 a are shifted from each other inthe horizontal direction by a distance corresponding to the horizontalspacing of the perforations 65.

A mother block obtained by the above-mentioned stacking is cut along thecutting lines 33 a and 34 a illustrated in FIGS. 21A and 21B, and thegreen chip 19 a as illustrated in FIG. 20 is obtained. Each of thesecond cutting lines 33 a is located so as to divide the perforations 65in halves in the horizontal direction, and the first cutting lines 34 aare located in such a way that two cutting lines 34 a cross a singleperforation 65.

In the preferred embodiment described above with reference to FIG. 20and FIGS. 21A and 21B, the lead section of each of the internalelectrodes 26 a and 27 a is narrower in width than the opposing sectionof each of the internal electrodes 26 a and 27 a, and extends with apredetermined width. The area of the opposing section that is contiguousto the lead section gradually decreases in width so as to becomesubstantially equal to the width of the lead section.

In the above-mentioned preferred embodiment, by modifying the shape ofthe perforations 65, the shape of the lead section of each of theinternal electrodes 26 a and 27 a, and the shape of the end of theopposing section that is contiguous to the lead section can be modifiedin various ways. For example, it is also possible to modify the shape ofthe perforations 65 to a rectangle.

In the aforementioned preferred embodiment, after the green chips 19 areobtained from the mother block 35 by cutting the mother block 35 alongeach of the cutting lines 33 and 34 illustrated in FIGS. 5A and 5B, theceramic paste 43 used to form the ceramic protective layers 22 and 23 isapplied to the cut side surfaces 20 and 21. This step can be alsomodified as follows.

That is, a first cutting step is performed first. In the first cuttingstep, after the mother block 35 is obtained, the mother block 35 is cutonly along the first cutting lines 34 illustrated in FIGS. 5A and 5B tothereby obtain a plurality of rod-shaped green block bodies, with theinternal electrodes 26 and 27 being exposed on the cut side surfaces 20and 21 that are produced by cutting along the first cutting lines 34.

Next, the rod-shaped green block bodies are affixed to an adhesive sheethaving expandability, and an applying step including a tumbling step,which is substantially the same as the above-mentioned applying stepincluding the tumbling step described with reference to FIGS. 7A to 14is performed. As a result, the ceramic paste 43 is applied to the cutside surfaces 20 and 21, and the ceramic protective layers 22 and 23 intheir raw state are formed on the rod-shaped green block bodies.

Next, a second cutting step is performed. In the second cutting step,each of the rod-shaped green block bodies on which the raw ceramicprotective layers 22 and 23 have been formed is cut along the secondcutting lines 33 perpendicular or substantially perpendicular to theabove-mentioned first direction, thereby obtaining a plurality of rawcomponent bodies 12.

Thereafter, as in the aforementioned preferred embodiment, each of theraw component bodies 12 is fired, and the same steps as those mentionedabove are subsequently performed, thereby completing the monolithicceramic capacitor 11.

While preferred embodiments of the present invention have been describedabove, it is to be understood that variations and modifications will beapparent to those skilled in the art without departing from the scopeand spirit of the present invention. The scope of the present invention,therefore, is to be determined solely by the following claims.

1. A manufacturing method for a monolithic ceramic electronic component,comprising the steps of: preparing a mother block including a pluralityof ceramic green sheets that are stacked on each other, and an internalelectrode pattern arranged along each of a plurality of interfacesbetween the ceramic green sheets; cutting the mother block along a firstcutting line and a second cutting line extending in mutuallyperpendicular or substantially perpendicular directions to obtain aplurality of green chips, the green chips each having a laminatedstructure including a plurality of ceramic layers and a plurality ofinternal electrodes that are in a raw state, the internal electrodesbeing exposed on a cut side surface that is produced by cutting alongthe first cutting line; applying a ceramic paste to the cut side surfaceto form a raw ceramic protective layer and obtain a raw component bodythat is a component body in a raw state; and firing the raw componentbody; wherein the applying step includes the steps of: preparing anapplication plate that holds the ceramic paste; bringing the ceramicpaste held by the application plate into contact with the cut sidesurface of each of the green chips; and transferring the ceramic pasteto the cut side surface of each of the green chips by moving each of thegreen chips and the application plate relative to each other in adirection in which the cut side surface extends while separating each ofthe green chips from the application plate in a state in which theceramic paste is connected to both of each of the green chips and theapplication plate.
 2. The manufacturing method for a monolithic ceramicelectronic component according to claim 1, wherein: the green chips cutin the cutting step are arrayed in row and column directions; theapplying step further includes a step of tumbling the green chips in astate in which the green chips arrayed in the row and column directionsare spaced apart from each other, to make the cut side surface of eachof the green chips uniformly an open surface; and in the applying step,the ceramic paste is simultaneously applied to the cut side surface ofeach of the green chips that has become the open surface as a result ofthe tumbling step.
 3. The manufacturing method for a monolithic ceramicelectronic component according to claim 1, wherein: the rod-shaped greenblock bodies cut in the first cutting step are arrayed in apredetermined direction; the applying step further includes the step oftumbling the rod-shaped green block bodies in a state in which therod-shaped green block bodies arrayed in the predetermined direction arespaced apart from each other, to make the cut side surface of each ofthe rod-shaped green block bodies uniformly an open surface; and in theapplying step, the ceramic paste is simultaneously applied to the cutside surface of each of the rod-shaped green block bodies that hasbecome the open surface as a result of the tumbling step.
 4. Themanufacturing method for a monolithic ceramic electronic componentaccording to claim 1, wherein the application plate includes anapplication surface that abuts against the cut side surface and isprovided with a recess to hold the ceramic paste, the recess beingfilled with the ceramic paste.
 5. The manufacturing method for amonolithic ceramic electronic component according to claim 1, whereinthe ceramic paste has a viscosity of about 100 mPa to about 10000 mPa atabout 10 rpm as measured with an E-type viscometer.
 6. The manufacturingmethod for a monolithic ceramic electronic component according to claim1, wherein the step of preparing the mother block includes the steps of:preparing the ceramic green sheets; forming the internal electrodepattern on each of the ceramic green sheets; and stacking the ceramicgreen sheets while shifting the ceramic green sheets from each other bya predetermined distance in a predetermined direction.
 7. Themanufacturing method for a monolithic ceramic electronic componentaccording to claim 1, further comprising the step of forming an externalelectrode on a predetermined surface of the component body so as to beelectrically connected to a specific one of the internal electrodes. 8.A manufacturing method for a monolithic ceramic electronic component,comprising the steps of: preparing a mother block including a pluralityof ceramic green sheets that are stacked on each other, and an internalelectrode pattern arranged along each of a plurality of interfacesbetween the ceramic green sheets; performing a first cutting includingcutting the mother block along a first cutting line to obtain aplurality of rod-shaped green block bodies, the rod-shaped green blockbodies each having a laminated structure including a plurality ofceramic layers and a plurality of internal electrodes that are in a rawstate, the internal electrodes being exposed on a cut side surface thatis produced by cutting along the first cutting line; applying a ceramicpaste to the cut side surface to form a raw ceramic protective layer;performing a second cutting including cutting each of the rod-shapedgreen block bodies on which the raw ceramic protective layer has beenformed along a second cutting line extending in a directionperpendicular or substantially perpendicular to the first cutting lineto obtain a plurality of raw component bodies that are each a componentbody in a raw state; and firing each of the raw component bodies;wherein the applying step includes the steps of: preparing anapplication plate that holds the ceramic paste; bringing the ceramicpaste held by the application plate into contact with the cut sidesurface of each of the rod-shaped green block bodies; and transferringthe ceramic paste to the cut side surface of each of the rod-shapedgreen block bodies, by moving each of the rod-shaped green block bodiesand the application plate relative to each other in a direction in whichthe cut side surface extends while separating each of the rod-shapedgreen block bodies from the application plate in a state in which theceramic paste is connected to both of each of the rod-shaped green blockbodies and the application plate.
 9. The manufacturing method for amonolithic ceramic electronic component according to claim 8, wherein:the rod-shaped green block bodies cut in the first cutting step arearrayed in a predetermined direction; the applying step further includesthe step of tumbling the rod-shaped green block bodies in a state inwhich the rod-shaped green block bodies arrayed in the predetermineddirection are spaced apart from each other, to make the cut side surfaceof each of the rod-shaped green block bodies uniformly an open surface;and in the applying step, the ceramic paste is simultaneously applied tothe cut side surface of each of the rod-shaped green block bodies thathas become the open surface as a result of the tumbling step.
 10. Themanufacturing method for a monolithic ceramic electronic componentaccording to claim 8, wherein the application plate includes anapplication surface that abuts against the cut side surface and isprovided with a recess to hold the ceramic paste, the recess beingfilled with the ceramic paste.
 11. The manufacturing method for amonolithic ceramic electronic component according to claim 8, whereinthe ceramic paste has a viscosity of about 100 mPa to about 10000 mPa atabout 10 rpm as measured with an E-type viscometer.
 12. Themanufacturing method for a monolithic ceramic electronic componentaccording to claim 8, wherein the step of preparing the mother blockincludes the steps of: preparing the ceramic green sheets; forming theinternal electrode pattern on each of the ceramic green sheets; andstacking the ceramic green sheets while shifting the ceramic greensheets from each other by a predetermined distance in a predetermineddirection.
 13. The manufacturing method for a monolithic ceramicelectronic component according to claim 8, further comprising the stepof forming an external electrode on a predetermined surface of thecomponent body so as to be electrically connected to a specific one ofthe internal electrodes.